Vulnerabilities > Qualcomm > Mdm9655 Firmware

DATE CVE VULNERABILITY TITLE RISK
2021-07-13 CVE-2021-1888 Double Free vulnerability in Qualcomm products
Memory corruption in key parsing and import function due to double freeing the same heap allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-415
7.2
2021-07-13 CVE-2021-1889 Classic Buffer Overflow vulnerability in Qualcomm products
Possible buffer overflow due to lack of length check in Trusted Application in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-120
7.2
2021-07-13 CVE-2021-1890 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Improper length check of public exponent in RSA import key function could cause memory corruption.
local
low complexity
qualcomm CWE-119
7.2
2021-06-09 CVE-2020-11292 Classic Buffer Overflow vulnerability in Qualcomm products
Possible buffer overflow in voice service due to lack of input validation of parameters in QMI Voice API in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-120
7.2
2021-06-09 CVE-2020-11159 Out-of-bounds Read vulnerability in Qualcomm products
Buffer over-read can happen while processing WPA,RSN IE of beacon and response frames if IE length is less than length of frame pointer being accessed in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
network
low complexity
qualcomm CWE-125
critical
9.4
2021-06-09 CVE-2020-11233 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
Time-of-check time-of-use race condition While processing partition entries due to newly created buffer was read again from mmc without validation in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
6.9
2021-06-09 CVE-2020-11235 Integer Overflow or Wraparound vulnerability in Qualcomm products
Buffer overflow might occur while parsing unified command due to lack of check of input data received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-190
7.2
2021-06-09 CVE-2020-11239 Use After Free vulnerability in Qualcomm products
Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-416
7.2
2021-06-09 CVE-2020-11241 Out-of-bounds Read vulnerability in Qualcomm products
Out of bound read will happen if EAPOL Key length is less than expected while processing NAN shared key descriptor attribute in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
network
low complexity
qualcomm CWE-125
7.8
2021-05-07 CVE-2020-11279 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-190
critical
10.0