Vulnerabilities > Qualcomm > Mdm9655 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2021-09-09 | CVE-2021-1909 | Classic Buffer Overflow vulnerability in Qualcomm products Buffer overflow occurs in trusted applications due to lack of length check of parameters in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
2021-09-09 | CVE-2021-1935 | NULL Pointer Dereference vulnerability in Qualcomm products Possible null pointer dereference due to lack of validation check for passed pointer during key import in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 5.5 |
2021-09-08 | CVE-2020-11301 | Improper Authentication vulnerability in Qualcomm products Improper authentication of un-encrypted plaintext Wi-Fi frames in an encrypted network can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.5 |
2021-09-08 | CVE-2021-1916 | Out-of-bounds Write vulnerability in Qualcomm products Possible buffer underflow due to lack of check for negative indices values when processing user provided input in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
2021-09-08 | CVE-2021-1919 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Integer underflow can occur when the RTCP length is lesser than than the actual blocks present in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
2021-09-08 | CVE-2021-1920 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Integer underflow can occur due to improper handling of incoming RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
2021-07-13 | CVE-2021-1886 | Out-of-bounds Write vulnerability in Qualcomm products Incorrect handling of pointers in trusted application key import mechanism could cause memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
2021-07-13 | CVE-2021-1888 | Double Free vulnerability in Qualcomm products Memory corruption in key parsing and import function due to double freeing the same heap allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
2021-07-13 | CVE-2021-1889 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to lack of length check in Trusted Application in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
2021-07-13 | CVE-2021-1890 | Out-of-bounds Write vulnerability in Qualcomm products Improper length check of public exponent in RSA import key function could cause memory corruption. | 7.8 |