Vulnerabilities > Qualcomm > Mdm9650 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-02-12 | CVE-2022-33233 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to configuration weakness in modem wile sending command to write protected files. | 7.8 |
| 2023-02-12 | CVE-2022-33248 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in User Identity Module due to integer overflow to buffer overflow when a segement is received via qmi http. | 7.8 |
| 2023-02-12 | CVE-2022-33280 | Access of Uninitialized Pointer vulnerability in Qualcomm products Memory corruption due to access of uninitialized pointer in Bluetooth HOST while processing the AVRCP packet. | 8.8 |
| 2023-02-12 | CVE-2022-40512 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware due to buffer over-read while processing probe response or beacon. | 7.5 |
| 2023-01-09 | CVE-2022-25717 | Double Free vulnerability in Qualcomm products Memory corruption in display due to double free while allocating frame buffer memory | 7.8 |
| 2023-01-09 | CVE-2022-33266 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in Audio due to integer overflow to buffer overflow while music playback of clips like amr,evrc,qcelp with modified content. | 7.8 |
| 2023-01-09 | CVE-2022-33290 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS in Bluetooth HOST due to null pointer dereference when a mismatched argument is passed. | 7.5 |
| 2023-01-09 | CVE-2022-33299 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS due to null pointer dereference in Bluetooth HOST while receiving an attribute protocol PDU with zero length data. | 7.5 |
| 2023-01-09 | CVE-2022-40520 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to stack-based buffer overflow in Core | 7.8 |
| 2022-12-13 | CVE-2022-25677 | Use After Free vulnerability in Qualcomm products Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |