Vulnerabilities > Qualcomm > Mdm9640 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-10-19 | CVE-2022-25720 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in WLAN due to out of bound array access during connect/roaming in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
| 2022-10-19 | CVE-2022-25748 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in WLAN due to integer overflow to buffer overflow while parsing GTK frames. | 9.8 |
| 2022-10-19 | CVE-2022-25749 | Out-of-bounds Read vulnerability in Qualcomm products Transient Denial-of-Service in WLAN due to buffer over-read while parsing MDNS frames. | 7.5 |
| 2022-09-26 | CVE-2022-22058 | Use After Free vulnerability in Qualcomm products Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-09-16 | CVE-2022-22074 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory Corruption during wma file playback due to integer overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-09-02 | CVE-2022-22080 | Out-of-bounds Write vulnerability in Qualcomm products Improper validation of backend id in PCM routing process can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.8 |
| 2022-06-14 | CVE-2021-30341 | Out-of-bounds Write vulnerability in Qualcomm products Improper buffer size validation of DSM packet received can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 10.0 |
| 2022-06-14 | CVE-2021-30342 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Improper integrity check can lead to race condition between tasks PDCP and RRC? after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables | 7.1 |
| 2022-06-14 | CVE-2021-30344 | Unspecified vulnerability in Qualcomm products Improper authorization of a replayed LTE security mode command can lead to a denial of service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
| 2022-06-14 | CVE-2021-35072 | Improper Validation of Array Index vulnerability in Qualcomm products Possible buffer overflow due to improper validation of array index while processing external DIAG command in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |