Vulnerabilities > Qualcomm > Mdm9607 Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2018-09-20 CVE-2018-11982 Double Free vulnerability in Qualcomm products
In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure.
low complexity
qualcomm CWE-415
8.8
2018-09-20 CVE-2018-11292 Integer Overflow or Wraparound vulnerability in Qualcomm products
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, lack of input validation in WLANWMI command handlers can lead to integer & heap overflows.
local
low complexity
qualcomm CWE-190
7.8
2018-09-20 CVE-2018-11291 Use of Cryptographically Weak Pseudo-Random Number Generator (PRNG) vulnerability in Qualcomm products
In Snapdragon (Automobile, Mobile, Wear) in version IPQ8074, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA4531, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA9377, QCA9378, QCA9379, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, cryptographic issues due to the random number generator was not a strong one in NAN.
network
low complexity
qualcomm CWE-338
7.5
2018-09-20 CVE-2018-11290 Use of Cryptographically Weak Pseudo-Random Number Generator (PRNG) vulnerability in Qualcomm products
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820A, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests is not done properly due to a flawed RNG in use.
network
low complexity
qualcomm CWE-338
7.5
2018-09-20 CVE-2018-11285 Out-of-bounds Read vulnerability in Qualcomm products
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, while parsing FLAC file with corrupted picture block, a buffer over-read can occur.
local
low complexity
qualcomm CWE-125
7.8
2018-09-20 CVE-2018-11269 Improper Validation of Array Index vulnerability in Qualcomm products
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options.
local
low complexity
qualcomm CWE-129
7.8
2018-09-20 CVE-2018-11268 Improper Validation of Array Index vulnerability in Qualcomm products
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options.
local
low complexity
qualcomm CWE-129
7.8
2018-09-20 CVE-2018-11267 Improper Validation of Array Index vulnerability in Qualcomm products
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.
local
low complexity
qualcomm CWE-129
7.8
2018-09-20 CVE-2017-18280 Unspecified vulnerability in Qualcomm products
In Snapdragon (Automobile, Mobile, Wear) in version MDM9607, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDM429, SDM439, SDM632, Snapdragon_High_Med_2016, when a Trusted Application has opened the SPI/I2C interface to a particular device, it is possible for another Trusted Application to read the data on this open interface by calling the SPI/I2C read function.
local
low complexity
qualcomm
7.8
2018-07-06 CVE-2018-5892 Information Exposure vulnerability in Qualcomm products
The Touch Pal application can collect user behavior data without awareness by the user in Snapdragon Mobile and Snapdragon Wear.
network
low complexity
qualcomm CWE-200
7.5