Vulnerabilities > Qualcomm > Mdm9607 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2019-07-25 | CVE-2019-2308 | Unspecified vulnerability in Qualcomm products User application could potentially make RPC call to the fastrpc driver and the driver will allow the message to go through to the remote subsystem in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24 | 7.8 |
| 2019-07-25 | CVE-2019-2306 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Improper casting of structure while handling the buffer leads to out of bound read in display in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20 | 7.8 |
| 2019-07-25 | CVE-2019-2299 | Out-of-bounds Write vulnerability in Qualcomm products An out-of-bound write can be triggered by a specially-crafted command supplied by a userspace application. | 7.8 |
| 2019-07-25 | CVE-2019-2298 | Use After Free vulnerability in Qualcomm products Protection is missing while accessing md sessions info via macro which can lead to use-after-free in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, QCS405, QCS605, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 845 / SD 850, SD 855, SDM660, SDX20, SDX24 | 7.8 |
| 2019-07-25 | CVE-2019-2290 | Use After Free vulnerability in Qualcomm products Multiple open and close from multiple threads will lead camera driver to access destroyed session data pointer in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS605, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDM660, SDX20, SDX24, Snapdragon_High_Med_2016 | 7.8 |
| 2019-07-25 | CVE-2019-2278 | Improper Verification of Cryptographic Signature vulnerability in Qualcomm products User keystore signature is ignored in boot and can lead to bypass boot image signature verification in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile in MDM9607, MDM9640, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 712 / SD 710 / SD 670, SD 845 / SD 850, SDM660 | 7.8 |
| 2019-07-25 | CVE-2019-2272 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Buffer overflow can occur in display function due to lack of validation of header block size set by user. | 7.8 |
| 2019-07-25 | CVE-2019-2263 | Use After Free vulnerability in Qualcomm products Access to freed memory can happen while reading from diag driver due to use after free issue in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDM660, SDX20, Snapdragon_High_Med_2016 | 7.8 |
| 2019-07-25 | CVE-2019-2238 | Out-of-bounds Write vulnerability in Qualcomm products Lack of check of data type can lead to subsequent loop-expression potentially go negative and the condition will still evaluate to true leading to buffer underflow. | 7.8 |
| 2019-07-25 | CVE-2019-2235 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Buffer overflow occurs when emulated RPMB is used due to sector size assumptions in the TA rollback protection logic. | 7.8 |