Vulnerabilities > Qualcomm > Mdm9607 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-09-08 | CVE-2021-1972 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to improper validation of device types during P2P search in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 10.0 |
| 2021-07-13 | CVE-2021-1955 | Reachable Assertion vulnerability in Qualcomm products Denial of service in SAP case due to improper handling of connections when association is rejected in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 5.0 |
| 2021-06-09 | CVE-2020-11267 | Out-of-bounds Write vulnerability in Qualcomm products Stack out-of-bounds write occurs while setting up a cipher device if the provided IV length exceeds the max limit value in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 4.6 |
| 2021-06-09 | CVE-2020-11292 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow in voice service due to lack of input validation of parameters in QMI Voice API in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
| 2021-06-09 | CVE-2020-11304 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read in DRM due to improper buffer length check. | 3.6 |
| 2021-06-09 | CVE-2020-11159 | Out-of-bounds Read vulnerability in Qualcomm products Buffer over-read can happen while processing WPA,RSN IE of beacon and response frames if IE length is less than length of frame pointer being accessed in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 9.4 |
| 2021-06-09 | CVE-2020-11233 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Time-of-check time-of-use race condition While processing partition entries due to newly created buffer was read again from mmc without validation in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.9 |
| 2021-06-09 | CVE-2020-11235 | Integer Overflow or Wraparound vulnerability in Qualcomm products Buffer overflow might occur while parsing unified command due to lack of check of input data received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.2 |
| 2021-06-09 | CVE-2020-11241 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read will happen if EAPOL Key length is less than expected while processing NAN shared key descriptor attribute in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-05-07 | CVE-2020-11279 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 10.0 |