Vulnerabilities > Qualcomm > Mdm9206 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2019-05-24 | CVE-2018-11271 | Improper Authentication vulnerability in Qualcomm products Improper authentication can happen on Remote command handling due to inappropriate handling of events in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SM7150, Snapdragon_High_Med_2016, SXR1130 | 7.5 |
| 2019-05-06 | CVE-2017-18279 | Integer Overflow or Wraparound vulnerability in Qualcomm products Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016. | 7.2 |
| 2019-05-06 | CVE-2017-18278 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products An integer underflow may occur due to lack of check when received data length from font_mgr_qsee_request_service is bigger than the minimal value of the segment header, which may result in a buffer overflow, in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850. | 7.2 |
| 2019-05-06 | CVE-2017-18276 | Unspecified vulnerability in Qualcomm products Secure camera logic allows display/secure camera controllers to access HLOS memory during secure display or camera session in Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SD 845, SD 850 | 7.2 |
| 2019-05-06 | CVE-2017-18274 | Improper Validation of Array Index vulnerability in Qualcomm products While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835 | 7.2 |
| 2019-05-06 | CVE-2017-18157 | Use After Free vulnerability in Qualcomm products A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20. | 7.2 |
| 2019-05-06 | CVE-2017-18156 | Use After Free vulnerability in Qualcomm products While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20. | 7.2 |
| 2019-05-06 | CVE-2017-18131 | Improper Initialization vulnerability in Qualcomm products In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016. | 7.2 |
| 2019-04-04 | CVE-2018-13918 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products kernel could return a received message length higher than expected, which leads to buffer overflow in a subsequent operation and stops normal operation in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, in MDM9150, MDM9206, MDM9607, MDM9650, MSM8909W, QCS605, Qualcomm 215, SD 425, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDX24, SM7150 | 7.2 |
| 2019-04-04 | CVE-2018-11970 | Unspecified vulnerability in Qualcomm products TZ App dynamic allocations not protected from XBL loader in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9206, MDM9607, MDM9650, MDM9655, QCS605, SD 410/12, SD 636, SD 712 / SD 710 / SD 670, SD 845 / SD 850, SD 8CX, SDA660, SDM630, SDM660, SXR1130 | 7.2 |