Vulnerabilities > Qualcomm > Mdm9205 Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-04-13 | CVE-2022-33222 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read while parsing DNS response packets in Modem. | 7.5 |
2023-04-13 | CVE-2022-33223 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS in Modem due to null pointer dereference while processing the incoming packet with http chunked encoding. | 7.5 |
2023-04-13 | CVE-2022-33228 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure sue to buffer over-read in modem while processing ipv6 packet with hop-by-hop or destination option in header. | 7.5 |
2023-04-13 | CVE-2022-33231 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in core while initializing the encryption key. | 7.8 |
2023-04-13 | CVE-2022-33294 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS in Modem due to NULL pointer dereference while receiving response of lwm2m registration/update/bootstrap request message. | 7.5 |
2023-04-13 | CVE-2022-33295 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in Modem due to buffer over-read while parsing the wms message received given the buffer and its length. | 7.5 |
2023-03-10 | CVE-2022-25694 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in Modem due to usage of Out-of-range pointer offset in UIM | 7.8 |
2023-03-10 | CVE-2022-25705 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in modem due to integer overflow to buffer overflow while handling APDU response | 7.8 |
2023-03-10 | CVE-2022-33213 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in modem due to buffer overflow while processing a PPP packet | 8.8 |
2023-03-10 | CVE-2022-33257 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone. | 7.0 |