Vulnerabilities > Qualcomm > Ipq9574 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2025-01-06 | CVE-2024-45558 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS can occur when the driver parses the per STA profile IE and tries to access the EXTN element ID without checking the IE length. | 7.5 |
2024-12-02 | CVE-2024-33056 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption when allocating and accessing an entry in an SMEM partition continuously. | 7.8 |
2024-12-02 | CVE-2024-33063 | Integer Overflow or Wraparound vulnerability in Qualcomm products Transient DOS while parsing the ML IE when a beacon with common info length of the ML IE greater than the ML IE inside which this element is present. | 7.5 |
2024-11-04 | CVE-2024-33068 | Use After Free vulnerability in Qualcomm products Transient DOS while parsing fragments of MBSSID IE from beacon frame. | 6.5 |
2024-10-07 | CVE-2024-33049 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing noninheritance IE of Extension element when length of IE is 2 of beacon frame. | 7.5 |
2024-10-07 | CVE-2024-33066 | Unspecified vulnerability in Qualcomm products Memory corruption while redirecting log file to any file location with any file name. | 9.8 |
2024-10-07 | CVE-2024-33073 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while parsing the BSS parameter change count or MLD capabilities fields of the ML IE. | 8.2 |
2024-10-07 | CVE-2024-38397 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing probe response and assoc response frame. | 7.5 |
2024-09-02 | CVE-2024-33045 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when BTFM client sends new messages over Slimbus to ADSP. | 7.8 |
2024-09-02 | CVE-2024-33048 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the received TID-to-link mapping element of beacon/probe response frame. | 7.5 |