Vulnerabilities > Qualcomm > Ipq4019 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-06-09 | CVE-2020-11267 | Out-of-bounds Write vulnerability in Qualcomm products Stack out-of-bounds write occurs while setting up a cipher device if the provided IV length exceeds the max limit value in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-06-09 | CVE-2020-11235 | Integer Overflow or Wraparound vulnerability in Qualcomm products Buffer overflow might occur while parsing unified command due to lack of check of input data received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-06-09 | CVE-2020-11256 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption due to lack of check of validation of pointer to buffer passed to trustzone in Snapdragon Wired Infrastructure and Networking | 8.8 |
| 2021-06-09 | CVE-2020-11257 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption due to lack of validation of pointer arguments passed to TrustZone BSP in Snapdragon Wired Infrastructure and Networking | 8.8 |
| 2021-06-09 | CVE-2020-11258 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption due to lack of validation of pointer arguments passed to Trustzone BSP in Snapdragon Wired Infrastructure and Networking | 8.8 |
| 2021-06-09 | CVE-2020-11259 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption due to lack of validation of pointer arguments passed to Trustzone BSP in Snapdragon Wired Infrastructure and Networking | 8.8 |
| 2021-06-09 | CVE-2020-11265 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure issue due to lack of validation of pointer arguments passed to TZ BSP in Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2021-06-09 | CVE-2020-11266 | Unspecified vulnerability in Qualcomm products Image address is dereferenced before validating its range which can cause potential QSEE information leakage in Snapdragon Wired Infrastructure and Networking | 6.5 |
| 2021-05-07 | CVE-2021-1915 | Classic Buffer Overflow vulnerability in Qualcomm products Buffer overflow can occur due to improper validation of NDP application information length in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-05-07 | CVE-2021-1927 | Use After Free vulnerability in Qualcomm products Possible use after free due to lack of null check while memory is being freed in FastRPC driver in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |