Vulnerabilities > Qualcomm > Immersive Home 326 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2025-02-03 | CVE-2024-45571 | Use After Free vulnerability in Qualcomm products Memory corruption may occour occur when stopping the WLAN interface after processing a WMI command from the interface. | 7.8 |
| 2025-01-06 | CVE-2024-45558 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS can occur when the driver parses the per STA profile IE and tries to access the EXTN element ID without checking the IE length. | 7.5 |
| 2024-09-02 | CVE-2024-33045 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when BTFM client sends new messages over Slimbus to ADSP. | 7.8 |
| 2024-09-02 | CVE-2024-33048 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the received TID-to-link mapping element of beacon/probe response frame. | 7.5 |
| 2024-09-02 | CVE-2024-33050 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper. | 7.5 |
| 2024-09-02 | CVE-2024-33057 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the multi-link element Control field when common information length check is missing before updating the location. | 7.5 |
| 2024-06-03 | CVE-2023-43537 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while handling T2LM Action Frame in WLAN Host. | 7.5 |
| 2024-03-04 | CVE-2023-28578 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Core Services while executing the command for removing a single event listener. | 7.8 |
| 2024-03-04 | CVE-2023-43549 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while processing TPC target power table in FTM TPC. | 7.8 |