Vulnerabilities > Qualcomm > Fastconnect 7800 Firmware > Medium
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2024-10-07 | CVE-2024-23374 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption is possible when an attempt is made from userspace or console to write some haptics effects pattern to the haptics debugfs file. | 6.7 |
2024-10-07 | CVE-2024-23376 | Use After Free vulnerability in Qualcomm products Memory corruption while sending the persist buffer command packet from the user-space to the kernel space through the IOCTL call. | 6.7 |
2024-10-07 | CVE-2024-23379 | Double Free vulnerability in Qualcomm products Memory corruption while unmapping the fastrpc map when two threads can free the same map in concurrent scenario. | 6.7 |
2024-10-07 | CVE-2024-38425 | Incorrect Authorization vulnerability in Qualcomm products Information disclosure while sending implicit broadcast containing APP launch information. | 6.1 |
2024-09-02 | CVE-2024-33043 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while handling PS event when Program Service name length offset value is set to 255. | 5.5 |
2024-08-05 | CVE-2024-23357 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS while importing a PKCS#8-encoded RSA key with zero bytes modulus. | 5.5 |
2024-07-01 | CVE-2024-21460 | Use of Insufficiently Random Values vulnerability in Qualcomm products Information disclosure when ASLR relocates the IMEM and Secure DDR portions as one chunk in virtual address space. | 6.5 |
2024-07-01 | CVE-2024-21462 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while loading the TA ELF file. | 5.5 |
2024-02-06 | CVE-2023-33060 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in Core when DDR memory check is called while DDR is not initialized. | 5.5 |
2024-01-02 | CVE-2023-33014 | Improper Input Validation vulnerability in Qualcomm products Information disclosure in Core services while processing a Diag command. | 6.8 |