Vulnerabilities > Qualcomm > Fastconnect 6900 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-02-06 | CVE-2023-43534 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption while validating the TID to Link Mapping action request frame, when a station connects to an access point. | 9.8 |
| 2024-02-06 | CVE-2023-43535 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption when negative display IDs are sent as input while processing DISPLAYESCAPE event trigger. | 7.8 |
| 2024-02-06 | CVE-2023-43536 | Unspecified vulnerability in Qualcomm products Transient DOS while parse fils IE with length equal to 1. | 7.5 |
| 2024-02-06 | CVE-2023-33046 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in Trusted Execution Environment while deinitializing an object used for license validation. | 7.0 |
| 2024-02-06 | CVE-2023-33049 | Memory Leak vulnerability in Qualcomm products Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage. | 7.5 |
| 2024-02-06 | CVE-2023-33057 | Improper Input Validation vulnerability in Qualcomm products Transient DOS in Multi-Mode Call Processor while processing UE policy container. | 7.5 |
| 2024-02-06 | CVE-2023-33058 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in Modem while processing SIB5. | 9.1 |
| 2024-02-06 | CVE-2023-33060 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in Core when DDR memory check is called while DDR is not initialized. | 5.5 |
| 2024-02-06 | CVE-2023-33064 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in Audio when invoking callback function of ASM driver. | 5.5 |
| 2024-02-06 | CVE-2023-33065 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in Audio while accessing AVCS services from ADSP payload. | 7.1 |