Vulnerabilities > Qualcomm > Fastconnect 6900 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |
| 2024-07-01 | CVE-2024-23372 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while invoking IOCTL call for GPU memory allocation and size param is greater than expected size. | 7.8 |
| 2024-07-01 | CVE-2024-23373 | Use After Free vulnerability in Qualcomm products Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released. | 7.8 |
| 2024-07-01 | CVE-2024-23380 | Use After Free vulnerability in Qualcomm products Memory corruption while handling user packets during VBO bind operation. | 7.8 |
| 2024-02-06 | CVE-2023-33067 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points. | 7.8 |
| 2024-02-06 | CVE-2023-33068 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Audio while processing IIR config data from AFE calibration block. | 7.8 |
| 2024-02-06 | CVE-2023-33069 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Audio while processing the calibration data returned from ACDB loader. | 7.8 |
| 2024-02-06 | CVE-2023-33072 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core while processing control functions. | 7.8 |
| 2024-02-06 | CVE-2023-33076 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. | 7.8 |
| 2024-02-06 | CVE-2023-33077 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in HLOS while converting from authorization token to HIDL vector. | 7.8 |