Vulnerabilities > Qualcomm > Fastconnect 6800 Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2024-09-02 | CVE-2024-33048 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the received TID-to-link mapping element of beacon/probe response frame. | 7.5 |
2024-09-02 | CVE-2024-33051 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing TIM IE from beacon frame as there is no check for IE length. | 7.5 |
2024-09-02 | CVE-2024-33052 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when user provides data for FM HCI command control operations. | 7.8 |
2024-09-02 | CVE-2024-33060 | Use After Free vulnerability in Qualcomm products Memory corruption when two threads try to map and unmap a single node simultaneously. | 7.8 |
2024-08-05 | CVE-2024-33014 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing ESP IE from beacon/probe response frame. | 7.5 |
2024-08-05 | CVE-2024-33020 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing TID-to-link mapping IE elements. | 7.5 |
2024-08-05 | CVE-2024-33023 | Use After Free vulnerability in Qualcomm products Memory corruption while creating a fence to wait on timeline events, and simultaneously signal timeline events. | 7.8 |
2024-08-05 | CVE-2024-33024 | Integer Overflow or Wraparound vulnerability in Qualcomm products Transient DOS while parsing the ML IE when a beacon with length field inside the common info of ML IE greater than the ML IE length. | 7.5 |
2024-08-05 | CVE-2024-33025 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the BSS parameter change count or MLD capabilities fields of the ML IE. | 7.5 |
2024-07-01 | CVE-2023-43554 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while processing IOCTL handler in FastRPC. | 7.8 |