Vulnerabilities > Qualcomm > Fastconnect 6700 Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-11-04 | CVE-2024-23385 | Reachable Assertion vulnerability in Qualcomm products Transient DOS as modem reset occurs when an unexpected MAC RAR (with invalid PDU length) is seen at UE. | 6.5 |
| 2024-11-04 | CVE-2024-33032 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption when the user application modifies the same shared memory asynchronously when kernel is accessing it. | 6.7 |
| 2024-11-04 | CVE-2024-38405 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing the CU information from RNR IE. | 6.5 |
| 2024-09-02 | CVE-2024-33043 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while handling PS event when Program Service name length offset value is set to 255. | 5.5 |
| 2024-08-05 | CVE-2024-23357 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS while importing a PKCS#8-encoded RSA key with zero bytes modulus. | 5.5 |
| 2024-07-01 | CVE-2024-21462 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while loading the TA ELF file. | 5.5 |
| 2024-02-06 | CVE-2023-33060 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in Core when DDR memory check is called while DDR is not initialized. | 5.5 |
| 2024-01-02 | CVE-2023-33037 | Missing Encryption of Sensitive Data vulnerability in Qualcomm products Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data. | 5.5 |
| 2023-12-05 | CVE-2023-28586 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE. | 6.5 |
| 2023-11-07 | CVE-2023-28563 | Unspecified vulnerability in Qualcomm products Information disclosure in IOE Firmware while handling WMI command. | 5.5 |