Vulnerabilities > Qualcomm > Apq8017 Firmware > Critical

DATE CVE VULNERABILITY TITLE RISK
2021-09-08 CVE-2021-1920 Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products
Integer underflow can occur due to improper handling of incoming RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-191
critical
10.0
2021-09-08 CVE-2021-1919 Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products
Integer underflow can occur when the RTCP length is lesser than than the actual blocks present in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-191
critical
10.0
2021-09-08 CVE-2021-1916 Out-of-bounds Write vulnerability in Qualcomm products
Possible buffer underflow due to lack of check for negative indices values when processing user provided input in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-787
critical
10.0
2021-07-13 CVE-2020-11307 Improper Validation of Array Index vulnerability in Qualcomm products
Buffer overflow in modem due to improper array index check before copying into it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
network
low complexity
qualcomm CWE-129
critical
10.0
2021-06-09 CVE-2020-11291 Improper Validation of Array Index vulnerability in Qualcomm products
Possible buffer overflow while updating ikev2 parameters for delete payloads received during informational exchange due to lack of check of input validation for certain parameters received from the ePDG server in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile
network
low complexity
qualcomm CWE-129
critical
10.0
2021-06-09 CVE-2020-11176 Out-of-bounds Write vulnerability in Qualcomm products
While processing server certificate from IPSec server, certificate validation for subject alternative name API can cause heap overflow which can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile
network
low complexity
qualcomm CWE-787
critical
10.0
2021-06-09 CVE-2020-11159 Out-of-bounds Read vulnerability in Qualcomm products
Buffer over-read can happen while processing WPA,RSN IE of beacon and response frames if IE length is less than length of frame pointer being accessed in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
network
low complexity
qualcomm CWE-125
critical
9.4
2021-05-07 CVE-2021-1910 Double Free vulnerability in Qualcomm products
Double free in video due to lack of input buffer length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-415
critical
10.0
2021-05-07 CVE-2020-11285 Out-of-bounds Read vulnerability in Qualcomm products
Buffer over-read while unpacking the RTCP packet we may read extra byte if wrong length is provided in RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-125
critical
9.4
2021-05-07 CVE-2020-11279 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-190
critical
10.0