Vulnerabilities > Qualcomm > Apq8009 Firmware

DATE CVE VULNERABILITY TITLE RISK
2021-06-09 CVE-2020-11262 Use After Free vulnerability in Qualcomm products
A race between command submission and destroying the context can cause an invalid context being added to the list leads to use after free issue.
local
high complexity
qualcomm CWE-416
7.0
2021-05-07 CVE-2020-11279 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-190
critical
9.8
2021-05-07 CVE-2020-11285 Out-of-bounds Read vulnerability in Qualcomm products
Buffer over-read while unpacking the RTCP packet we may read extra byte if wrong length is provided in RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-125
critical
9.1
2021-05-07 CVE-2020-11289 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Out of bound write can occur in TZ command handler due to lack of validation of command ID in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-119
7.8
2021-05-07 CVE-2021-1905 Use After Free vulnerability in Qualcomm products
Possible use after free due to improper handling of memory mapping of multiple processes simultaneously.
local
low complexity
qualcomm CWE-416
7.8
2021-05-07 CVE-2021-1906 Improper Handling of Exceptional Conditions vulnerability in Qualcomm products
Improper handling of address deregistration on failure can lead to new GPU address allocation failure.
local
low complexity
qualcomm CWE-755
5.5
2021-05-07 CVE-2021-1910 Double Free vulnerability in Qualcomm products
Double free in video due to lack of input buffer length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-415
critical
9.8
2021-05-07 CVE-2021-1927 Use After Free vulnerability in Qualcomm products
Possible use after free due to lack of null check while memory is being freed in FastRPC driver in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-416
7.8
2021-04-07 CVE-2020-11255 Memory Leak vulnerability in Qualcomm products
Denial of service while processing RTCP packets containing multiple SDES reports due to memory for last SDES packet is freed and rest of the memory is leaked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables
network
low complexity
qualcomm CWE-401
7.5
2021-04-07 CVE-2020-11251 Out-of-bounds Read vulnerability in Qualcomm products
Out-of-bounds read vulnerability while accessing DTMF payload due to lack of check of buffer length before copying in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-125
critical
9.1