Vulnerabilities > Qualcomm > Apq5053 AA Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
2023-12-05 | CVE-2023-33017 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Boot while running a ListVars test in UEFI Menu during boot. | 7.8 |
2023-12-05 | CVE-2023-33018 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while using the UIM diag command to get the operators name. | 7.8 |
2023-12-05 | CVE-2023-33022 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in HLOS while invoking IOCTL calls from user-space. | 7.8 |
2023-12-05 | CVE-2023-33063 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Services during a remote call from HLOS to DSP. | 7.8 |
2023-12-05 | CVE-2023-33079 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in Audio while running invalid audio recording from ADSP. | 7.8 |
2023-12-05 | CVE-2023-33080 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. | 7.5 |
2023-12-05 | CVE-2023-33087 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core while processing RX intent request. | 7.8 |
2023-11-07 | CVE-2023-33031 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer. | 7.8 |
2023-11-07 | CVE-2023-33055 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Audio while invoking callback function in driver from ADSP. | 7.8 |