Vulnerabilities > Out-of-bounds Write
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2020-03-08 | CVE-2020-10222 | Out-of-bounds Write vulnerability in Gonitro Nitro PRO npdf.dll in Nitro Pro before 13.13.2.242 is vulnerable to Heap Corruption at npdf!nitro::get_property+2381 via a crafted PDF document. | 5.8 |
| 2020-03-07 | CVE-2020-10214 | Out-of-bounds Write vulnerability in Dlink Dir-825 Firmware 2.10 An issue was discovered on D-Link DIR-825 Rev.B 2.10 devices. | 9.0 |
| 2020-03-05 | CVE-2019-14050 | Out-of-bounds Write vulnerability in Qualcomm products Out-of-bound writes occurs due to lack of check of buffer size will cause buffer overflow only in 32bit architecture. | 7.2 |
| 2020-03-05 | CVE-2019-14028 | Out-of-bounds Write vulnerability in Qualcomm products Buffer overwrite during memcpy due to lack of check on SSID length validation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8064, APQ8096, APQ8096AU, APQ8098, IPQ6018, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8996AU, MSM8998, Nicobar, QCA4531, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA8081, QCA9377, QCA9379, QCA9886, QCN7605, QCS404, QCS405, QCS605, Rennell, SA6155P, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 | 7.2 |
| 2020-03-05 | CVE-2019-14015 | Out-of-bounds Write vulnerability in Qualcomm products A stack-based buffer overflow exists in the initialization of the identification stage due to lack of check on the number of templates provided. | 7.2 |
| 2020-03-05 | CVE-2019-14000 | Out-of-bounds Write vulnerability in Qualcomm products Lack of check that the RX FIFO write index that is read from shared RAM is less than the FIFO size results into memory corruption and potential information leakage in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, IPQ6018, IPQ8074, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCS404, QCS405, QCS605, QM215, Rennell, SA6155P, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 | 7.2 |
| 2020-03-05 | CVE-2019-10612 | Out-of-bounds Write vulnerability in Qualcomm products UTCB object has a function pointer called by the reaper to deallocate its memory resources and this address can potentially be corrupted by stack overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 | 10.0 |
| 2020-03-05 | CVE-2019-10604 | Out-of-bounds Write vulnerability in Qualcomm products Possibility of heap-buffer-overflow during last iteration of loop while populating image version information in diag command response packet, in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8053, APQ8096AU, APQ8098, MDM9607, MDM9640, MSM8909W, MSM8917, MSM8953, Nicobar, QCS605, QM215, Rennell, SA6155P, Saipan, SDA660, SDM429, SDM439, SDM450, SDM632, SDM670, SDM710, SDM845, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 | 7.2 |
| 2020-03-05 | CVE-2019-10587 | Out-of-bounds Write vulnerability in Qualcomm products Possible Stack overflow can occur when processing a large SDP body or non standard SDP body without right delimiters in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, Rennell, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130 | 10.0 |
| 2020-03-05 | CVE-2019-10569 | Out-of-bounds Write vulnerability in Qualcomm products Stack buffer overflow due to instance id is misplaced inside definition of hardware accelerated effects in makefile in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile in APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130 | 7.2 |