Vulnerabilities > Integer Overflow or Wraparound
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2019-12-12 | CVE-2019-18301 | Integer Overflow or Wraparound vulnerability in Siemens Sppa-T3000 Ms3000 Migration Server A vulnerability has been identified in SPPA-T3000 MS3000 Migration Server (All versions). | 7.5 |
| 2019-12-12 | CVE-2019-18300 | Integer Overflow or Wraparound vulnerability in Siemens Sppa-T3000 Ms3000 Migration Server A vulnerability has been identified in SPPA-T3000 MS3000 Migration Server (All versions). | 7.5 |
| 2019-12-12 | CVE-2019-18299 | Integer Overflow or Wraparound vulnerability in Siemens Sppa-T3000 Ms3000 Migration Server A vulnerability has been identified in SPPA-T3000 MS3000 Migration Server (All versions). | 7.5 |
| 2019-12-12 | CVE-2019-18298 | Integer Overflow or Wraparound vulnerability in Siemens Sppa-T3000 Ms3000 Migration Server A vulnerability has been identified in SPPA-T3000 MS3000 Migration Server (All versions). | 7.5 |
| 2019-12-12 | CVE-2019-10592 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow while multiplying two integers of 32 bit in QDCM API of get display modes as there is no check on the maximum mode count in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCS405, QCS605, QM215, SDA660, SDA845, SDM429, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 | 7.8 |
| 2019-12-12 | CVE-2019-10530 | Integer Overflow or Wraparound vulnerability in Qualcomm products Lack of check of data truncation on user supplied data in kernel leads to buffer overflow in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, SD 210/SD 212/SD 205, SD 425, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24 | 7.8 |
| 2019-12-12 | CVE-2019-19746 | Integer Overflow or Wraparound vulnerability in multiple products make_arrow in arrow.c in Xfig fig2dev 3.2.7b allows a segmentation fault and out-of-bounds write because of an integer overflow via a large arrow type. | 5.5 |
| 2019-12-12 | CVE-2019-5093 | Integer Overflow or Wraparound vulnerability in Leadtools 20.0.2019.3.15 An exploitable code execution vulnerability exists in the DICOM network response functionality of LEADTOOLS libltdic.so version 20.0.2019.3.15. | 9.8 |
| 2019-12-12 | CVE-2019-5085 | Integer Overflow or Wraparound vulnerability in Leadtools 20.0.2019.3.15 An exploitable code execution vulnerability exists in the DICOM packet-parsing functionality of LEADTOOLS libltdic.so, version 20.0.2019.3.15. | 9.8 |
| 2019-12-10 | CVE-2019-13736 | Integer Overflow or Wraparound vulnerability in multiple products Integer overflow in PDFium in Google Chrome prior to 79.0.3945.79 allowed a remote attacker to potentially exploit heap corruption via a crafted PDF file. | 8.8 |