Vulnerabilities > Double Free
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-04-24 | CVE-2023-29469 | Double Free vulnerability in multiple products An issue was discovered in libxml2 before 2.10.4. | 6.5 |
| 2023-04-13 | CVE-2022-33231 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in core while initializing the encryption key. | 7.8 |
| 2023-03-31 | CVE-2023-28464 | Double Free vulnerability in multiple products hci_conn_cleanup in net/bluetooth/hci_conn.c in the Linux kernel through 6.2.9 has a use-after-free (observed in hci_conn_hash_flush) because of calls to hci_dev_put and hci_conn_put. | 7.8 |
| 2023-03-30 | CVE-2022-4744 | Double Free vulnerability in Linux Kernel A double-free flaw was found in the Linux kernel’s TUN/TAP device driver functionality in how a user registers the device when the register_netdevice function fails (NETDEV_REGISTER notifier). | 7.8 |
| 2023-03-30 | CVE-2023-27537 | Double Free vulnerability in multiple products A double free vulnerability exists in libcurl <8.0.0 when sharing HSTS data between separate "handles". | 5.9 |
| 2023-03-24 | CVE-2023-21030 | Double Free vulnerability in Google Android 13.0 In Confirmation of keystore_cli_v2.cpp, there is a possible way to corrupt memory due to a double free. | 7.8 |
| 2023-03-10 | CVE-2022-40515 | Double Free vulnerability in Qualcomm products Memory corruption in Video due to double free while playing 3gp clip with invalid metadata atoms. | 9.8 |
| 2023-03-06 | CVE-2022-3707 | Double Free vulnerability in multiple products A double-free memory flaw was found in the Linux kernel. | 5.5 |
| 2023-02-28 | CVE-2023-27320 | Double Free vulnerability in multiple products Sudo before 1.9.13p2 has a double free in the per-command chroot feature. | 7.2 |
| 2023-02-25 | CVE-2023-26545 | Double Free vulnerability in multiple products In the Linux kernel before 6.1.13, there is a double free in net/mpls/af_mpls.c upon an allocation failure (for registering the sysctl table under a new location) during the renaming of a device. | 4.7 |