Vulnerabilities > Buffer Copy without Checking Size of Input ('Classic Buffer Overflow')
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2020-02-12 | CVE-2019-16336 | Classic Buffer Overflow vulnerability in Cypress Cybl11573 and Cyble-416045 The Bluetooth Low Energy implementation in Cypress PSoC 4 BLE component 3.61 and earlier processes data channel frames with a payload length larger than the configured link layer maximum RX payload size, which allows attackers (in radio range) to cause a denial of service (crash) via a crafted BLE Link Layer frame. | 6.5 |
| 2020-02-12 | CVE-2019-19196 | Classic Buffer Overflow vulnerability in Telink-Semi products The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an attacker in radio range to cause a buffer overflow and denial of service (crash) via crafted packets. | 6.5 |
| 2020-02-12 | CVE-2015-7890 | Classic Buffer Overflow vulnerability in Samsung Galaxy S6 Edge Firmware Multiple buffer overflows in the esa_write function in /dev/seirenin the Exynos Seiren Audio driver, as used in Samsung S6 Edge, allow local users to cause a denial of service (memory corruption) via a large (1) buffer or (2) size parameter. | 5.5 |
| 2020-02-11 | CVE-2009-4067 | Classic Buffer Overflow vulnerability in multiple products Buffer overflow in the auerswald_probe function in the Auerswald Linux USB driver for the Linux kernel before 2.6.27 allows physically proximate attackers to execute arbitrary code, cause a denial of service via a crafted USB device, or take full control of the system. | 6.8 |
| 2020-02-10 | CVE-2019-17520 | Classic Buffer Overflow vulnerability in TI Cc2640R2 Software Development KIT The Bluetooth Low Energy implementation on Texas Instruments SDK through 3.30.00.20 for CC2640R2 devices does not properly restrict the SM Public Key packet on reception, allowing attackers in radio range to cause a denial of service (crash) via crafted packets. | 6.5 |
| 2020-02-10 | CVE-2019-17518 | Classic Buffer Overflow vulnerability in Dialog-Semiconductor Software Development KIT 1.0.14.1081 The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 1.0.14.1081 for DA1468x devices responds to link layer packets with a payload length larger than expected, allowing attackers in radio range to cause a buffer overflow via a crafted packet. | 6.5 |
| 2020-02-10 | CVE-2019-17517 | Classic Buffer Overflow vulnerability in Dialog-Semiconductor Software Development KIT 1.0.14.1081/5.0.4 The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet. | 5.7 |
| 2020-02-10 | CVE-2019-17061 | Classic Buffer Overflow vulnerability in Cypress Psoc 4 BLE 3.62 The Bluetooth Low Energy (BLE) stack implementation on Cypress PSoC 4 through 3.62 devices does not properly restrict the BLE Link Layer header and executes certain memory contents upon receiving a packet with a Link Layer ID (LLID) equal to zero. | 6.5 |
| 2020-02-10 | CVE-2019-17060 | Classic Buffer Overflow vulnerability in NXP Mcuxpresso Software Development KIT 2.2.1 The Bluetooth Low Energy (BLE) stack implementation on the NXP KW41Z (based on the MCUXpresso SDK with Bluetooth Low Energy Driver 2.2.1 and earlier) does not properly restrict the BLE Link Layer header and executes certain memory contents upon receiving a packet with a Link Layer ID (LLID) equal to zero. | 6.5 |
| 2020-02-07 | CVE-2019-14041 | Classic Buffer Overflow vulnerability in Qualcomm products During listener modified response processing, a buffer overrun occurs due to lack of buffer size verification when updating message buffer with physical address information in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8917, MSM8953, MSM8996AU, Nicobar, QCM2150, QCS405, QCS605, QM215, Rennell, SA6155P, Saipan, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 | 7.8 |