Vulnerabilities > CVE-2020-11208 - Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products
Attack vector
LOCAL Attack complexity
LOW Privileges required
LOW Confidentiality impact
HIGH Integrity impact
HIGH Availability impact
HIGH Summary
Out of Bound issue in DSP services while processing received arguments due to improper validation of length received as an argument' in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439
Vulnerable Configurations
| Part | Description | Count |
|---|---|---|
| OS | Qualcomm
| 13 |
| Hardware | 13 |
Common Weakness Enumeration (CWE)
References
- https://blog.checkpoint.com/2020/08/06/achilles-small-chip-big-peril/
- https://research.checkpoint.com/2021/pwn2own-qualcomm-dsp/
- https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin
- https://blog.checkpoint.com/2020/08/06/achilles-small-chip-big-peril/
- https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin
- https://research.checkpoint.com/2021/pwn2own-qualcomm-dsp/