Vulnerabilities > CVE-2020-11202 - Out-of-bounds Write vulnerability in Qualcomm products
Attack vector
LOCAL Attack complexity
LOW Privileges required
LOW Confidentiality impact
HIGH Integrity impact
HIGH Availability impact
HIGH Summary
Buffer overflow/underflow occurs when typecasting the buffer passed by CPU internally in the library which is not aligned with the actual size of the structure' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCM6125, QCS410, QCS603, QCS605, QCS610, QCS6125, SA6145P, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA670, SDA845, SDM640, SDM670, SDM710, SDM830, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM8150, SM8150P
Vulnerable Configurations
Common Weakness Enumeration (CWE)
References
- https://blog.checkpoint.com/2020/08/06/achilles-small-chip-big-peril/
- https://research.checkpoint.com/2021/pwn2own-qualcomm-dsp/
- https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin
- https://blog.checkpoint.com/2020/08/06/achilles-small-chip-big-peril/
- https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin
- https://research.checkpoint.com/2021/pwn2own-qualcomm-dsp/