Vulnerabilities > CVE-2019-14085 - Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products
Attack vector
LOCAL Attack complexity
LOW Privileges required
LOW Confidentiality impact
HIGH Integrity impact
HIGH Availability impact
HIGH Summary
Possible Integer underflow in WLAN function due to lack of check of data received from user side in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCN7605, QCS605, SDA845, SDM670, SDM710, SDM845, SDM850, SM8150, SXR1130
Vulnerable Configurations
| Part | Description | Count |
|---|---|---|
| OS | 9 | |
| Hardware | 9 |