Vulnerabilities > CVE-2019-14083 - Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products
Summary
While parsing Service Descriptor Extended Attribute received as part of SDF frame, there is a possibility that incorrect length is specified in the attribute length field of extended SSI which can lead to integer underflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, APQ8096, APQ8098, IPQ6018, IPQ8074, MSM8996AU, MSM8998, Nicobar, QCA6174A, QCA6390, QCA6574AU, QCA8081, QCA9377, QCA9379, QCN7605, QCS404, QCS405, QCS605, Rennell, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SM6150, SM7150, SM8150, SXR1130, SXR2130