Vulnerabilities > Qualcomm > Smb358 Firmware

DATE CVE VULNERABILITY TITLE RISK
2021-05-07 CVE-2020-11279 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-190
critical
10.0
2021-05-07 CVE-2020-11285 Out-of-bounds Read vulnerability in Qualcomm products
Buffer over-read while unpacking the RTCP packet we may read extra byte if wrong length is provided in RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-125
critical
9.4
2021-05-07 CVE-2020-11289 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Out of bound write can occur in TZ command handler due to lack of validation of command ID in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-119
7.2
2021-04-07 CVE-2020-11255 Memory Leak vulnerability in Qualcomm products
Denial of service while processing RTCP packets containing multiple SDES reports due to memory for last SDES packet is freed and rest of the memory is leaked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables
network
low complexity
qualcomm CWE-401
7.8
2021-04-07 CVE-2020-11251 Out-of-bounds Read vulnerability in Qualcomm products
Out-of-bounds read vulnerability while accessing DTMF payload due to lack of check of buffer length before copying in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-125
critical
9.4
2021-04-07 CVE-2020-11191 Out-of-bounds Read vulnerability in Qualcomm products
Out of bound read occurs while processing crafted SDP due to lack of check of null string in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
network
low complexity
qualcomm CWE-125
critical
9.4
2021-03-17 CVE-2020-11227 Improper Validation of Array Index vulnerability in Qualcomm products
Out of bound write while parsing RTT/TTY packet parsing due to lack of check of buffer size before copying into buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-129
7.5
2021-03-17 CVE-2020-11226 Improper Validation of Array Index vulnerability in Qualcomm products
Out of bound memory read in Data modem while unpacking data due to lack of offset length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-129
5.0
2021-03-17 CVE-2020-11221 Information Exposure vulnerability in Qualcomm products
Usage of syscall by non-secure entity can allow extraction of secure QTEE diagnostic information in clear text form due to insufficient checks in the syscall handler and leads to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-200
2.1
2021-03-17 CVE-2020-11199 Information Exposure vulnerability in Qualcomm products
HLOS to access EL3 stack canary by just mapping imem region due to Improper access control and can lead to information exposure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-200
2.1