Vulnerabilities > Qualcomm > Smb1350 Firmware

DATE CVE VULNERABILITY TITLE RISK
2021-06-09 CVE-2020-11159 Out-of-bounds Read vulnerability in Qualcomm products
Buffer over-read can happen while processing WPA,RSN IE of beacon and response frames if IE length is less than length of frame pointer being accessed in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
network
low complexity
qualcomm CWE-125
critical
9.4
2021-06-09 CVE-2020-11161 Out-of-bounds Read vulnerability in Qualcomm products
Out-of-bounds memory access can occur while calculating alignment requirements for a negative width from external components in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
local
low complexity
qualcomm CWE-125
3.6
2021-06-09 CVE-2020-11233 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
Time-of-check time-of-use race condition While processing partition entries due to newly created buffer was read again from mmc without validation in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
6.9
2021-06-09 CVE-2020-11235 Integer Overflow or Wraparound vulnerability in Qualcomm products
Buffer overflow might occur while parsing unified command due to lack of check of input data received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-190
7.2
2021-06-09 CVE-2020-11238 Out-of-bounds Read vulnerability in Qualcomm products
Possible Buffer over-read in ARP/NS parsing due to lack of check of packet length received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
network
low complexity
qualcomm CWE-125
7.8
2021-06-09 CVE-2020-11239 Use After Free vulnerability in Qualcomm products
Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-416
7.2
2021-06-09 CVE-2020-11261 Improper Input Validation vulnerability in Qualcomm products
Memory corruption due to improper check to return error when user application requests memory allocation of a huge size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-20
7.2
2021-06-09 CVE-2020-11262 Use After Free vulnerability in Qualcomm products
A race between command submission and destroying the context can cause an invalid context being added to the list leads to use after free issue.
4.4
2021-05-07 CVE-2020-11279 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-190
critical
10.0
2021-05-07 CVE-2020-11289 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Out of bound write can occur in TZ command handler due to lack of validation of command ID in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-119
7.2