Vulnerabilities > Qualcomm > Mdm9330 Firmware

DATE CVE VULNERABILITY TITLE RISK
2024-01-02 CVE-2023-33033 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Audio during playback with speaker protection.
local
low complexity
qualcomm CWE-787
7.8
2024-01-02 CVE-2023-33120 Use After Free vulnerability in Qualcomm products
Memory corruption in Audio when memory map command is executed consecutively in ADSP.
local
low complexity
qualcomm CWE-416
7.8
2023-12-05 CVE-2023-28550 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in MPP performance while accessing DSM watermark using external memory address.
local
low complexity
qualcomm CWE-787
7.8
2023-11-07 CVE-2023-33059 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Audio while processing the VOC packet data from ADSP.
local
low complexity
qualcomm CWE-787
7.8
2023-10-03 CVE-2023-22385 Out-of-bounds Write vulnerability in Qualcomm products
Memory Corruption in Data Modem while making a MO call or MT VOLTE call.
network
low complexity
qualcomm CWE-787
critical
9.8
2023-10-03 CVE-2023-24848 Unspecified vulnerability in Qualcomm products
Information Disclosure in Data Modem while performing a VoLTE call with an undefined RTCP FB line value.
network
low complexity
qualcomm
7.5
2023-09-05 CVE-2023-28560 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in WLAN HAL while processing devIndex from untrusted WMI payload.
local
low complexity
qualcomm CWE-787
7.8
2023-06-06 CVE-2022-33264 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message.
local
low complexity
qualcomm CWE-787
7.8
2023-06-06 CVE-2022-40521 Improper Authentication vulnerability in Qualcomm products
Transient DOS due to improper authorization in Modem
network
low complexity
qualcomm CWE-287
7.5
2023-04-13 CVE-2022-33289 Improper Validation of Array Index vulnerability in Qualcomm products
Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card.
low complexity
qualcomm CWE-129
6.8